SK hynix becomes the Industry’s First to Ship 24Gb DDR5 Samples.
SK hynix Inc. (or ‘the Company’, www.skhynix.com) in December 2021 announced that it has shipped samples of 24 Gigabit (Gb) DDR5* DRAM with the industry’s largest density for a single DRAM chip.
DDR (Double Data Rate): A comprehensive standard specification defined by JEDEC (Joint Electron Device Engineering Council) and applied to PCs, servers, and other applications; currently includes 5 generations of DDR 1-2-3-4-5. Currently, DDR DRAM offerings mostly come in the density of 8Gb or 16Gb, with the highest density of 16Gb
SK hynix’s announcement of the industry’s highest density DDR5 chip comes just 14 months after the company became the first to commercialize DDR5 DRAM in October 2020, confirming the chipmaker’s technological supremacy in DDR5. The new 24GB DDR5 memory was created using cutting-edge 1anm technology and the EUV process. It has a density of 24GB per chip, which is higher than the present density of 16GB in 1ynm DDR5, and it has enhanced production efficiency and performance by up to 33%.
Furthermore, SK hynix was able to cut the product’s power usage by *25% when compared to existing products, as well as minimize energy consumption in manufacturing through improved production efficiency. SK hynix anticipates that the product will reduce carbon emissions as well, which is important in terms of ESG management.
*Based on system power consumption to support the same module capacity
This product will initially be available in 48 Gigabyte (GB) and 96 GB modules for cloud data centers. It is also planned to power high-performance servers for large data processing, such as AI and machine learning, as well as Metaverse applications.
Kevin (Jongwon) Noh, President and Chief Marketing Officer at SK hynix, said, “In line with the release of 24Gb DDR5, SK hynix is closely engaging with a number of customers that provides cloud services. We will continue to strengthen our leadership in growing DDR5 market by introducing advanced technologies and developing products with ESG-awareness.”
“Intel and SK Hynix have a long history of strong collaboration,” said Carolyn Duran, Vice President of Memory and IO Technologies in Intel’s Data Center and AI Group. “Today’s announcement is another illustration of our two companies working together to deliver a 24Gb solution to address needs of our mutual customers. The 24Gb DDR5 offering provides high mono die capacity and will help customers boost performance of memory capacity bound workloads such as data analytics while bringing significant TCO benefits.”