AMD Unveils RX 7900 series graphics cards built on AMD RDNA 3 Architecture with Chiplet Design
The new graphics cards are the world’s first gaming graphics cards to feature an advanced AMD chiplet design
Search Results for: chiplet
VeriSilicon Joins the Universal Chiplet Interconnect Express Industry Consortium
VeriSilicon Joins the Universal Chiplet Interconnect Express Industry Consortium. Membership will drive VeriSilicon’s industrialization of chiplet-based projects and support aim…
Semiconductor Industry Standardizes Chiplet Ecosystem using Universal Chiplet Interconnect Express UICe Technology
Semiconductor Industry Standardizes Chiplet Ecosystem using Universal Chiplet Interconnect Express UICe Technology. Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google…
Intel unveils glass substrate to scale transistors and advance Moore’s Law
Intel unveils glass substrate to scale transistors and advance Moore's Law
Lockheed Martin and GlobalFoundries to advance innovation and resiliency of chips for national security
Lockheed Martin and GlobalFoundries to advance innovation and resiliency of chips for national security
AMD’s most powerful workstation graphics card the AMD Radeon PRO W7000 Series
AMD's most powerful workstation graphics card the AMD Radeon PRO W7000 Series
Intel and Arm announce multigeneration collaboration to build low-power SOCs
Intel and Arm announce multigeneration collaboration to build low-power SOCs Collaboration to bring chip designers a powerful combination of Arm…
Intel Research Paves the Way to a Trillion Transistors by 2030
Intel Research Paves the Way to a Trillion Transistors by 2030
DARPA’s Space-BACN to Accelerate Inter-Satellite Communications
A program providing space-based interoperable optical communications selects Intel to develop the underlying technology.
Intel Plans To Move From 100 Billion Transistors On A Package Today to 1 Trillion By 2030
Intel CEO Pat Gelsinger details how advanced compute and packaging are needed to meet the world’s insatiable demand for compute…
Heterogeneous Integration Chip-let System Package Alliance Established to Expand Market Opportunities.
Heterogeneous Integration Chip-let System Package Alliance Established to Expand Market Opportunities. HSINCHU, Dec. 27, 2021 – The rise of artificial intelligence (AI)…