MediaTek announced it is expanding its family of modems and chipsets to support 5G RedCap

MediaTek announced it is expanding its family of modems and chipsets to support 5G RedCap

MediaTek's Dimensity 9300 its most powerful flagship chip yet

MediaTek Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024

MediaTek announces Dimensity 9200+ chipset for flagship smartphones

MediaTek to Showcase 5G, Satellite Communications, Computing, and Connectivity Technology Advancements at MWC

TECNO to Launch Flagship Foldable Smartphone with MediaTek Dimensity 9000+ Processor at MWC 2023

MediaTek Introduces Global Ecosystem of Consumer-Ready Wi-Fi 7 Products at CES 2023

MediaTek Selects Keysight To Validate 5G Devices Equipped with MIMO Antenna Technology in Over-the-Air Test Environment. SANTA ROSA, Calif, August…

MediaTek  Announces Dimensity 9000+ SOC With Minor Enhancements. The company’s latest chipset offers device makers another high-performance option for flagship…

Filogic 880 and Filogic 380 will drive the next generation of connectivity with the fastest and most reliable Wi-Fi 7…

Dimensity 1050 mmWave SoC highlights trio of new chipsets expanding MediaTek’s 5G and gaming portfolio. HSINCHU, May 23, 2022 –…

MediaTek Launches Dimensity 9000 Flagship Chip. Built on the leading TSMC N4 process, Dimensity 9000 brings full flagship performance and…

New Motorola defy smartphone with satellite messaging unveiled at MWC 2023.

Oppo announces global availability of its flagship foldable smartphone Find N2 Flip

Wi-Fi CERTIFIED 6 Release 2 adds new features for advanced Wi-Fi® applications. Support for uplink capacity and greater power management…

MicroEJ and SEB to collaborate in integrating MicroEJ VEE Solution in electronic products. MicroEJ, a leader in software enablement solutions…