Intel deploys EUV lithography in high volume manufacturing in Ireland

Intel deploys EUV lithography in high volume manufacturing in Ireland

Biden-Harris Administration Announces Final National Security Guardrails for CHIPS for America Incentives Program.

US Deputy Secretary of Defense Announces $238m CHIPS and Science Act Award

Intel unveils glass substrate to scale transistors and advance Moore's Law

MediaTek Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024

Sony develops new module that harvests power from Electromagnetic Wave Noise for IoT devices

Sony to Release 1.3-type 4K Microdisplay that Reproduces Realistic Spaces for AR/VR headsets

Simple superconducting device from MIT can dramatically cut energy use in computing and other applications

Powered by the CHIPS Act Intel is doubling down on R&D for chip manufacturing

AMD Announces Plan to Invest Approximately $400 Million Over the Next Five Years to Expand Research, Development and Engineering Operations…

MIT researchers develop a new source of quantum light that could provide the basis for optical quantum computers

Intel Plans Assembly and Test Facility in Poland. Investment near Wrocław, Poland, will help create a first-of-its-kind end-to-end leading-edge manufacturing…

Intel's new quantum research chip Tunnel Falls a 12-qubit silicon chip

Lockheed Martin and GlobalFoundries to advance innovation and resiliency of chips for national security

European Commission approves €8.1 billion for research innovation in microelectronics and communication technology

2023 COMPUTEX closed with trends in AI-driven high-performance computing

Smartphones could one day be used to map magnetic fields and become portable quantum sensors

NVIDIA to Bring AI to Every Industry, CEO Says

Applied Materials New eBeam Metrology System for High-NA EUV Lithography

MIT engineers invent vertical, full-color microscopic LEDs could enable fully immersive virtual reality displays

ASML reports €21.2 billion net sales and €5.6 billion net income in 2022

MediaTek Introduces Global Ecosystem of Consumer-Ready Wi-Fi 7 Products at CES 2023

SK hynix to Showcase Energy-Efficient, High-Performance Memory Products at CES 2023

Rapidus and IBM to further develop IBM's 2 nanometer (nm) node technology in Japan. Rapidus, a Newly Formed Advanced Logic…

TSMC Arizona fab to begin production N4 process technology in 2024 and 3nm in 2026