With premium foldable smartphones, Samsung sets a new benchmark for mobile experiences.
With premium foldable smartphones, Samsung sets a new benchmark for mobile experiences. Samsung Electronics Co., Ltd. unveiled two new foldable…
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With premium foldable smartphones, Samsung sets a new benchmark for mobile experiences. Samsung Electronics Co., Ltd. unveiled two new foldable…
Leica’s Leitz Phone 1 smartphone with a 1-inch image sensor. With a Qualcomm® SnapdragonTM 888 CPU and a 1-inch image…
Smartphones with Snapdragon 888 plus will be available in Q3 2021. Snapdragon 888 Plus will be available in commercial smartphones…
Vodafone, Qualcomm, and Xiaomi successfully tested new 5G uplink technology in Europe
Google's Gemini Pro and Imagen 2 produce text, voice and image AI features in Samsung Galaxy S24 series
Qualcomm Snapdragon 8 Gen 3 is powering the latest Galaxy S24 Ultra globally
LG Gram Pro boasts ultra-slim, lightweight design and powerful performance with AI
Samsung introduces Galaxy Book4 Series with news Intel® Core™ Ultra 9 processor
Samsung introduces T5 EVO new portable drive with 8TB capacity and faster speeds
A new technique enables AI on edge devices to keep learning over time
MediaTek's Dimensity 9300 its most powerful flagship chip yet
Garmin’s new Descent Mk3 series dive computers have 200-meter dive ratings, AMOLED display and built-in flashlight
Humane launches Ai Pin, first wearable device built to harness power of artificial intelligence
Sony releases Alpha 9 III, world's first full frame camera with global shutter system
Xiaomi announces Xiaomi 14 Series with first Snapdragon® 8 Gen 3 Mobile Platform
DJI releases the Osmo Pocket 3 gimbal camera
Moungi Bawendi wins Nobel Prize in chemistry for quantum dots
Humane reveals wearable AI device at Coperni’s Paris fashion show ahead of full unveiling on November 9.
Apple unveils iPhone 15 Pro and iPhone 15 Pro Max with new A17 Pro chip and USB Type C
Deutsche Telekom demonstrates 6 GHz world record in mobile communications
MediaTek Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024
Sony Releases Two New Alpha 7C Series Cameras Alpha 7C II and Alpha 7CR
Amazon Introduces Blink Outdoor 4 its all-time best-selling line of security cameras
Xiaomi Unveils Xiaomi MIX Fold 3, CyberDog 2, and Other Latest Innovations
NASA’s Space-Based Quantum Science Lab (Cold Atom Lab) is getting its second major upgrade and will be using it to…
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