Intel Plans To Move From 100 Billion Transistors On A Package Today to 1 Trillion By 2030

Intel CEO Pat Gelsinger details how advanced compute and packaging are needed to meet the world’s insatiable demand for compute…

Inpria Co-Developing Metal Oxide Resist with SK hynix to Reduce Complexity of Patterning for Next-Generation DRAM. TOKYO, August 02, 2022…

Researchers find the missing photonic link to enable an all-silicon quantum internet. Researchers at Simon Fraser University have made a…

NASA, SpaceX Launch Climate Science Research to Space Station. WASHINGTON, July 14, 2022 – A SpaceX Dragon resupply spacecraft carrying…

SANTA CLARA, Calif, July 05, 2022 -Toolkit builds on two decades of Mobileye safety and driver-assistance technology to provide new…

MediaTek  Announces Dimensity 9000+ SOC With Minor Enhancements. The company’s latest chipset offers device makers another high-performance option for flagship…

MacBook Air features a new, strikingly thin design in four beautiful finishes, larger 13.6-inch Liquid Retina display, 1080p HD camera,…

M2 delivers power-efficient performance and capabilities to the completely redesigned MacBook Air and updated 13-inch MacBook Pro. The M2 chip…

CARIAD selects Snapdragon Ride™ Platform’s system-on-chips (SoCs) for its unified scalable software platform Tailored SoCs are a crucial element for…

Finland: IQM’s Quantum Fabrication Facility Gets a €35 Million Boost From the EIB. The funding will be used to accelerate…

Babcock & Wilcox Partners with Kiewit Industrial to Develop and Deliver World’s Largest Net-Negative CO2 Biomass-to-Energy Facility for Fidelis New Energy…

VeriSilicon Joins the Universal Chiplet Interconnect Express Industry Consortium. Membership will drive VeriSilicon’s industrialization of chiplet-based projects and support aim…

Quantum Physics Sets a Speed Limit to Electronics. Semiconductor electronics is getting faster and faster – but at some point,…

3rd Gen AMD EPYC™ processors with AMD 3D V-Cache™ technology — available on Microsoft Azure HBv3 virtual machines (VMs) — will be offered…

Apple introduces the M1 Ultra, the world’s most powerful PC chip. CUPERTINO, CALIFORNIA March 8, 2022 – Apple unveiled the…

HONOR Announces Global Launch of all-new HONOR Magic4 Pro Series at MWC 2022. SHENZHEN, China, Feb. 28, 2022 – At Mobile…

SEOUL, South Korea, Feb. 15, 2022 /PRNewswire/ — SK hynix (or “the Company”, www.skhynix.com) announced on February 16 that it has developed PIM, a…

NEW YORK, Jan. 31, 2022 – According to Persistence Market Research’s smartphone market estimate, the market was valued at US$ 507.5…

Samsung has released a smart all-in-one fingerprint security IC for biometric payment cards. With enhanced security capabilities offered by Samsung’s…

Samsung’s PCIe 5.0 SSD for High-Performance Enterprise Servers. Samsung’s PCIe 5.0 SSD will deliver nearly double the data transfer speeds…

Wi-Fi CERTIFIED 6 Release 2 adds new features for advanced Wi-Fi® applications. Support for uplink capacity and greater power management…

SK hynix has completed the first phase of its acquisition of Intel’s NAND and SSD businesses. SK hynix has acquired…

Heterogeneous Integration Chip-let System Package Alliance Established to Expand Market Opportunities. HSINCHU, Dec. 27, 2021 – The rise of artificial intelligence (AI)…

MicroEJ and SEB to collaborate in integrating MicroEJ VEE Solution in electronic products. MicroEJ, a leader in software enablement solutions…

MediaTek Launches Dimensity 9000 Flagship Chip. Built on the leading TSMC N4 process, Dimensity 9000 brings full flagship performance and…