Snapdragon Digital Chassis Solutions will be used by Stellantis and Qualcomm to power new vehicle platforms.
Snapdragon Digital Chassis Solutions will be used by Stellantis and Qualcomm to power new vehicle platforms. Beginning in 2024, Snapdragon®…
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Kioxia and Western Digital Jointly Invest in New Flash Memory Manufacturing Facility in Yokkaichi Plant
Kioxia and Western Digital Jointly Invest in New Flash Memory Manufacturing Facility in Yokkaichi Plant. Initial Production to Begin in…
ClassOne Equipment Selected to Represent High-Performance Takano Particle Inspection Systems
ClassOne Equipment Selected to Represent High-Performance Takano Particle Inspection Systems
Kioxia Corporation Commences Construction of New Fabrication Facility at Kitakami Plant
KITAKAMI, Japan, April 05, 2022 – Kioxia Corporation, the world leader in memory solutions, today held a groundbreaking ceremony for…
VeriSilicon Joins the Universal Chiplet Interconnect Express Industry Consortium
VeriSilicon Joins the Universal Chiplet Interconnect Express Industry Consortium. Membership will drive VeriSilicon’s industrialization of chiplet-based projects and support aim…
Quantum Physics Sets a Speed Limit to Electronics
Quantum Physics Sets a Speed Limit to Electronics. Semiconductor electronics is getting faster and faster – but at some point,…
Goldpack Group Promotes SuperSim in Macau, a sim card with data storage and financial-grade security.
Goldpack Group Promotes SuperSim, a sim card with data storage and financial-grade security. HONG KONG, Feb. 25, 2022 – China Telecom just…
SK hynix develops next-generation memory chip with computing capabilities
SEOUL, South Korea, Feb. 15, 2022 /PRNewswire/ — SK hynix (or “the Company”, www.skhynix.com) announced on February 16 that it has developed PIM, a…
The highest M&A deal value took place in 2021, exceeding expectations with a value of about $6 trillion.
Bain & Company’s fourth global M&A report shows 89% of M&A executives expect deal activity to stay the same or…
As per Coherent Market Insights, the global eSIM market would cross $19.3 billion by 2027.
SEATTLE, Feb. 7, 2022 – According to Coherent Market Insights, The global eSIM market was valued at US$ 8.3 Bn in 2019 and is expected to reach US$…
IBM and Government of Quebec Launch First IBM Quantum System in Canada
IBM and Government of Quebec Launch First IBM Quantum System in Canada – The Quebec-IBM Discovery Accelerator seeks to advance discovery…
Samsung has released a smart all-in-one fingerprint security IC for biometric payment cards.
Samsung has released a smart all-in-one fingerprint security IC for biometric payment cards. With enhanced security capabilities offered by Samsung’s…
Intel to invest $20 billion in the development of two new chip facilities in Ohio
Intel will invest more than $20 billion to build two new factories and to establish a new epicenter for advanced…
Exynos 2200 Processor With Xclipse GPU Powered By AMD RDNA 2 Architecture
The new Exynos 2200 high-end mobile processor features hardware-accelerated ray tracing and cutting-edge Arm-based computing and Xclipse GPU. Samsung Electronics,…
Wi-Fi CERTIFIED 6 Release 2 adds new features for advanced Wi-Fi® applications
Wi-Fi CERTIFIED 6 Release 2 adds new features for advanced Wi-Fi® applications. Support for uplink capacity and greater power management…
SK hynix has completed the first phase of its acquisition of Intel’s NAND and SSD businesses.
SK hynix has completed the first phase of its acquisition of Intel’s NAND and SSD businesses. SK hynix has acquired…
Heterogeneous Integration Chip-let System Package Alliance Established to Expand Market Opportunities.
Heterogeneous Integration Chip-let System Package Alliance Established to Expand Market Opportunities. HSINCHU, Dec. 27, 2021 – The rise of artificial intelligence (AI)…
Hertz to order 100,000 Teslas by 2022
Hertz to order 100,000 Teslas by end of 2022. The Hertz Corporation one of the largest vehicle rental companies, Hertz…
Sony is planning to release a stacked SPAD depth sensor for automotive LiDAR.
Sony is planning to release a stacked SPAD depth sensor for automotive LiDAR. Enhanced Detection and Recognition Capabilities for Automotive…
Samsung’s ISOCELL HP1 sensor will allow smartphones to take images at 200 megapixels.
Samsung’s ISOCELL HP1 sensor will allow smartphones to take images at 200 megapixels. Samsung’s new mobile image sensors include advanced…
TSMC has surpassed Tencent as Asia’s most valuable company.
TSMC has surpassed Tencent as Asia’s most valuable company. Taiwan Semiconductor Manufacturing Company (TSMC), the world’s largest chipmaker, has surpassed…
Exynos W920 is Industry’s First 5nm Processor Powering the Next Generation of Wearables
Exynos W920 is Industry’s First 5nm Processor Powering the Next Generation of Wearables. Samsung Electronics Co., Ltd., a global leader…
Worlds first 2-nanometer chip technology from IBM
Worlds first 2-nanometer chip technology from IBM. Every decade is a decade to test the limits of Moore’s Law, and…
Samsung’s new flagship 5nm Exynos 2100 processor
Samsung’s new flagship 5nm Exynos 2100 processor with enhanced NPU and integrated 5G capabilities was announced in a virtual event…
Samsung’s future car concept Digital Cockpit 2021
Samsung’s future car concept Digital Cockpit 2021. Samsung today revealed more details about its future car concept the Digital Cockpit…