Intel claims breakthrough in transistor scaling technology that will extend Moore’s Law
Intel claims breakthrough in transistor scaling technology that will extend Moore's Law
MediaTek’s Dimensity 9300 its most powerful flagship chip yet
MediaTek's Dimensity 9300 its most powerful flagship chip yet
Intel deploys EUV lithography in high volume manufacturing in Ireland
Intel deploys EUV lithography in high volume manufacturing in Ireland
US Department of Commerce announces guardrails for CHIPS
Biden-Harris Administration Announces Final National Security Guardrails for CHIPS for America Incentives Program.
Intel unveils glass substrate to scale transistors and advance Moore’s Law
Intel unveils glass substrate to scale transistors and advance Moore's Law
Intel, Ericsson Expand Collaboration to Advance Next-Gen Optimized 5G Infrastructure
Intel, Ericsson Expand Collaboration to Advance Next-Gen Optimized 5G Infrastructure. Intel to manufacture future custom 5G SoC for Ericsson on 18A process technology.
European Commission approves €8.1 billion for research innovation in microelectronics and communication technology
European Commission approves €8.1 billion for research innovation in microelectronics and communication technology
Apple introduces M2 Ultra its largest and most capable Apple chip yet
Apple introduces M2 Ultra largest and most capable Apple chip yet
Intel and Arm announce multigeneration collaboration to build low-power SOCs
Intel and Arm announce multigeneration collaboration to build low-power SOCs Collaboration to bring chip designers a powerful combination of Arm core and Intel angstrom-era process technology advancements.
Applied Materials New eBeam Metrology System for High-NA EUV Lithography
Applied Materials New eBeam Metrology System for High-NA EUV Lithography
Intel unveils 4th Gen Xeon scalable processor Sapphire Rapids for HPC workloads
Intel unveils 4th Gen Xeon scalable processor Sapphire Rapids for HPC workloads.
TSMC Arizona fab to begin production N4 process technology in 2024 and 3nm in 2026
TSMC Arizona fab to begin production N4 process technology in 2024 and 3nm in 2026
Intel’s Quantum Chip Production Research Demonstrates Exceptional Yield of Quantum Dot Arrays
Intel demonstrates exceptional yield of quantum dot arrays, showing promise for large-scale qubit production using transistor fabrication technology.
Micron to invest up to $100 Billion to Build Megafab in Central New York
Sustainably built and operated, leading-edge memory fab to create nearly 50,000 New York jobs; New Green CHIPS Community Fund to invest $500 million in community and workforce development over time
SK hynix to Build New Fabrication Plant (M15X Fab) in Cheongju South Korea
SK hynix to Build New Fabrication Plant (M15X Fab) in Cheongju South Korea. Highlights Company to break ground in October, complete construction in early 2025 with plan to invest 15…
SkyWater Plans to Build Advanced $1.8B Semiconductor Manufacturing Facility in Partnership with the State of Indiana and Purdue University
SkyWater Plans to Build Advanced $1.8B Semiconductor Manufacturing Facility in Partnership with the State of Indiana and Purdue University. Public-private partnership to pursue CHIPS funding critical for national security, advanced…
Kioxia and Western Digital Jointly Invest in New Flash Memory Manufacturing Facility in Yokkaichi Plant
Kioxia and Western Digital Jointly Invest in New Flash Memory Manufacturing Facility in Yokkaichi Plant. Initial Production to Begin in the Fall of Calendar 2022 TOKYO & SAN JOSE, Calif…
Intel completes expansion of $3 billion semiconductor fabrication plant in Hillsboro, Oregon
Intel completes expansion of $3 billion semiconductor fabrication plant in Hillsboro, Oregon. The company celebrates the heritage of innovation by renaming Ronler Acres campus in honor of Intel co-founder Gordon…
ClassOne Equipment Selected to Represent High-Performance Takano Particle Inspection Systems
ClassOne Equipment Selected to Represent High-Performance Takano Particle Inspection Systems
VeriSilicon Joins the Universal Chiplet Interconnect Express Industry Consortium
VeriSilicon Joins the Universal Chiplet Interconnect Express Industry Consortium. Membership will drive VeriSilicon’s industrialization of chiplet-based projects and support aim of becoming a leading provider of commercialized chiplets globally. SHANGHAI,…
SK hynix develops next-generation memory chip with computing capabilities
SEOUL, South Korea, Feb. 15, 2022 /PRNewswire/ — SK hynix (or “the Company”, www.skhynix.com) announced on February 16 that it has developed PIM, a next-generation memory chip with computing capabilities.…
Intel to buy Tower Semiconductor for $5.4 billion
Transaction creates a globally diverse end-to-end foundry to help meet growing semiconductor demand and brings more value to customers across the nearly $100 billion addressable foundry market. Acquisition accelerates Intel’s…
SK hynix becomes the Industry’s First to Ship 24Gb DDR5 Samples
SK hynix becomes the Industry’s First to Ship 24Gb DDR5 Samples. SK hynix Inc. (or ‘the Company’, www.skhynix.com) in December 2021 announced that it has shipped samples of 24 Gigabit…
SK hynix has completed the first phase of its acquisition of Intel’s NAND and SSD businesses.
SK hynix has completed the first phase of its acquisition of Intel’s NAND and SSD businesses. SK hynix has acquired Intel’s SSD business and Dalian NAND Flash Manufacturing Facility assets…
TSMC has surpassed Tencent as Asia’s most valuable company.
TSMC has surpassed Tencent as Asia’s most valuable company. Taiwan Semiconductor Manufacturing Company (TSMC), the world’s largest chipmaker, has surpassed Chinese tech powerhouse Tencent to become Asia’s most valuable company,…