Qualcomm and Microsoft Align Efforts to Scale On-Device AI at Build
Qualcomm and Microsoft Align Efforts to Scale On-Device AI at Build
MediaTek announces Dimensity 9200+ chipset for flagship smartphones
MediaTek announces Dimensity 9200+ chipset for flagship smartphones
Chips Act: Europe to double its global semiconductor share from 10% to 30% by 2030
Chips Act: Europe to double its global semiconductor share from 10% to 30% by 2030. European Council and Parliament strike provisional deal.
Intel and Arm announce multigeneration collaboration to build low-power SOCs
Intel and Arm announce multigeneration collaboration to build low-power SOCs Collaboration to bring chip designers a powerful combination of Arm core and Intel angstrom-era process technology advancements.
NVIDIA to Bring AI to Every Industry, CEO Says
NVIDIA to Bring AI to Every Industry, CEO Says
Samsung announces Exynos Connect U100 ultra-wideband chipset for precise distance and location information
Samsung announces Exynos Connect U100 ultra-wideband chipset for precise distance and location information for use in mobile, automotive, and Internet of Things (IoT) devices.
Qualcomm Unveils Snapdragon 7-Series Mobile Platform
Qualcomm Unveils Snapdragon 7-Series Mobile Platform
Applied Materials New eBeam Metrology System for High-NA EUV Lithography
Applied Materials New eBeam Metrology System for High-NA EUV Lithography
TECNO to Launch Flagship Foldable Smartphone Phantom V Fold with MediaTek Dimensity 9000+ at MWC 2023
TECNO to Launch Flagship Foldable Smartphone with MediaTek Dimensity 9000+ Processor at MWC 2023
MIT engineers invent vertical, full-color microscopic LEDs could enable fully immersive virtual reality displays
MIT engineers invent vertical, full-color microscopic LEDs could enable fully immersive virtual reality displays
ASML reports €21.2 billion net sales and €5.6 billion net income in 2022
ASML reports €21.2 billion net sales and €5.6 billion net income in 2022
Apple unveils M2 Pro and M2 Max supercharging MacBook Pro and Mac mini
Apple unveils M2 Pro and M2 Max supercharging MacBook Pro and Mac mini
Intel unveils 4th Gen Xeon scalable processor Sapphire Rapids for HPC workloads
Intel unveils 4th Gen Xeon scalable processor Sapphire Rapids for HPC workloads.
ArchieTek AI startup to showcase edge-AI processor for localization, mapping and obstacle avoidance at CES 2023
ArchieTek AI startup to showcase edge-AI processor for localization, mapping and obstacle avoidance at CES 2023
SK hynix to Showcase Energy-Efficient, High-Performance Memory Products at CES 2023
SK hynix to Showcase Energy-Efficient, High-Performance Memory Products at CES 2023
13th Gen Intel Core i9-13900K overclocked to 9.008 GHz, ASUS team sets overclocking world record
13th Gen Intel Core i9-13900K overclocked to 9.008 GHz, ASUS team sets world record
Oppo Unveils OHealth H1 family health monitor, MariSilicon, and OPPO Air Glass 2
Oppo Unveils OHealth H1 family health monitor, MariSilicon, and OPPO Air Glass 2
Rapidus and IBM to further develop IBM’s 2 nanometer (nm) node technology in Japan
Rapidus and IBM to further develop IBM's 2 nanometer (nm) node technology in Japan. Rapidus, a Newly Formed Advanced Logic Foundry, Will Leverage IBM's Semiconductor R&D Leadership, Including 2 Nanometer…
TSMC Arizona fab to begin production N4 process technology in 2024 and 3nm in 2026
TSMC Arizona fab to begin production N4 process technology in 2024 and 3nm in 2026
Intel Research Paves the Way to a Trillion Transistors by 2030
Intel Research Paves the Way to a Trillion Transistors by 2030
AMD Brings 4th Gen AMD EPYC Processors to The Modern Data Center
AMD Brings 4th Gen AMD EPYC Processors to The Modern Data Center. – New AMD EPYC™ processors are the world’s fastest and most energy efficient, allowing customers to modernize their…
Intel Max Series product family to power the upcoming Aurora supercomputer at Argonne National Laboratory
As per Intel, the new family of products delivers CPU with high bandwidth memory, 4.8x faster than the competition, and Intel’s highest density GPU, to solve the world’s biggest challenges.
Samsung begins mass production of 1 Tb 8th-Gen Vertical NAND (V-NAND) With Industry’s Highest Bit Density
Samsung’s eighth-generation V-NAND features both the industry’s highest storage capacity and highest bit density to enable expanded storage space in next-generation servers.
AMD Unveils RX 7900 series graphics cards built on AMD RDNA 3 Architecture with Chiplet Design
The new graphics cards are the world’s first gaming graphics cards to feature an advanced AMD chiplet design
Samsung Introduces Industry’s Fastest LPDDR5X DRAM at 8.5Gbps
Samsung completes validation of LPDDR5X DRAM at operating speed of 8.5Gbps on Snapdragon mobile platforms, unlocking new markets for LPDDR memory.